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Fineplacer CorePlus.-
 Highlights
| * Placement accuracy better than 25 microns |
| * Component sizes from 0.25mm up to 50mm |
| * Board sizes up 400 mm x 300 mm |
| * Proven thermal management solution with hot air top and bottom heating |
| * Automated process with force measurment |
| * Compact integrated machine design |
| * Cost efficient soldering tools, compatible with all FINEPLACER rework stations |
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Caracteristicas
- Precision en colocacion mejor que 25 micras
- Tamanos de componentes de 0.25mm hasta 50mm
- Tamanos de tablillas hasta de 400 mm x 300 mm
- Solucion de control de temperatura comprobado con aire caliente por arriba y debajo de la tablilla.
- Proceso automatico con medicion de fuerza
- Diseno integrado compacto de la maquina
- Herramientas para soldar eficientes en costo, y compatibles con todas las estaciones de retrabajo FINEPLACER
Features
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Caracteristicas
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| Automated Soldering Processes |
Proceso de soldado automatico |
| Compact and robust design |
Diseno robusto y compacto |
| Vision alignment system with fixed beam splitter |
Sistema de alineacion visual con lente fijo articulado |
| Intelligent thermal management |
Control inteligente de temperatura |
| Real time process observation camera |
Camara de observacion en tiempo real |
Benefits
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Beneficios
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| User independent process operation |
Operacion de proceso independiente del usuario |
| The whole rework cycle within one cost-effective system solution |
Todo el ciclo de retrabajo en un sistema?de costo efectivo |
| Reproducible placement accuracy |
precision de colocacion reproducible |
| Coordinated control of all process parameters: temperature, flow, time, process environment |
Control coordinado de todos los parametros de control: temperatura, flujo, tiempo, ambiente de proceso |
| Immediate visual feedback reduces process development time |
Retroalimentacion visual inmediata, reduce el tiempo de desarrollo del proceso |
Technologies
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Tecnologias
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Applications
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Aplicaciones
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| Component removal |
Remover componentes |
Soldering of: |
Retrabajo de: |
| Site cleaning |
limpieza de area |
-- BGA, microBGA/CSP, QFN, PoP, QFP, PGA |
-- BGA, microBGA/CSP, QFN, PoP, QFP, PGA |
| Re-Balling (array) |
Reboleo (arreglo) |
-- small passives down to 0201 |
-- pasivos pequenos hasta 0201 |
| Paste printing |
impresion de soldadura |
-- RF Shields, RF Frames |
-- Marcos y escudos RF |
| Paste dipping |
sumersion de pasta |
-- Connectors, sockets |
-- conectores, sockets |
| Fluxing |
aplicacion de flux |
-- Subassemblies, daughter boards |
-- subensambles, tablillas hijas |
| Re-soldering |
Re-Soldado |
THT Pin in Paste |
THT pin en pasta |
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Reworkable underfill, conformal coating |
bajollenado retrabajable, aplicacion de conformal |
Technical Specifications
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| Placement Accuracy:??????????????25 microns |
| Filed of view (min)*:???????????????6.9 mm x 5.3 mm |
| Filed of view (max)*:???????????????71.5 mm x 53.6 mm |
| Component size (min)*:????????????0.25 mm x 0.25 mm |
| Components size (max)*:???????????50 mm x 50 mm |
| Power (reflow module):???????????? 900 Watts |
| Temperature ramp rate:????????????1 K/s to 50 K/s |
| Flow range:????????????????????? 10 Nl/min to 70 Nl/min |
| Power (board heater):*?????????????900 Watts |
| Heated area (max)*:???????????????100 mm x 100 mm |
| Thermocouples*:?????????????????4 |
| * depending on configuration |
Modules
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| Board Heater diffuser for RB07 |
| Component Printing Module (DCP) |
| Board Printing tools |
| BGA Reballing Module |
| Flux transfer station |
| Comopnent presentation |
| Process video module |
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